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We are looking for an experienced and talented Packaging Expert to join our integrated photonics team. As a Package Designer (m/w/d), you will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our photonic integrated circuits (PICs). You will work with multi-disciplinary teams to create innovative packaging designs that meet the technical requirements of advanced photonic systems. This is an exciting opportunity to be part of a fast-growing technology area, where you will contribute to the commercialisation and scaling of next-generation photonic technologies.
Package Design & Development:
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Design and develop photonic packaging solutions for photonic integrated circuits (PICs), including mechanical, thermal, and optical interfaces.
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Optimize package designs for performance, reliability, and manufacturability, considering thermal management, optical coupling, electrical connectivity, and mechanical stability.
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Work with materials such as silicon photonics, III-V semiconductors, and fiber-optic components in packaging designs.
Prototyping & Fabrication:
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Collaborate with external suppliers and internal teams to build prototypes and transition from concept to full-scale production.
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Ensure design-for-manufacturability (DFM) principles are applied to the photonic packages to ensure scalability and cost-effectiveness.
Thermal & Mechanical Analysis:
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Perform thermal and stress analysis of photonic packages to ensure proper heat dissipation and mechanical stability under varying environmental conditions.
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Use simulation tools to validate the design and ensure performance under thermal cycling, vibration, and mechanical stress.
Optical Alignment & Integration:
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Design package structures that optimize optical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectors.
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Develop high-precision alignment and assembly techniques to minimize optical losses and enhance signal integrity.
Collaboration:
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Work within a dedicated team of scientists and development engineers to drive the development of photonic technologies with respect to a wide range of applications.
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Work closely with photonic designers, engineers, process engineers, and manufacturing teams to refine packaging solutions.
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Support cross-functional teams in product development, providing input on package constraints and opportunities.
Testing and Validation:
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Define test protocols to validate the performance and reliability of the packaging solutions.
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Analyze data from thermal, mechanical, and optical tests to improve packaging designs and ensure product reliability.
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Master's degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
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Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems.
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3+ years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices.
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Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable.
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Experience working with optical beam assemblies is a plus.
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Experience working with high-frequency electrical packaging and RF interconnects is a plus.
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Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS).
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Experience with thermal and stress simulation tools such as COMSOL or FEA software.
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Understanding of materials used in photonics packaging, including ceramics, polymers, metals, and adhesives.
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Familiarity with cleanroom and assembly techniques for photonic and electronic components.
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Strong analytical and problem-solving skills, with attention to detail in complex systems.
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Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and German
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Ability to work in a fast-paced, deadline-driven environment.
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